Top 10 IC packaging substrate manufacturers in the world
The packaging substrate is used to carry the chip and connect the chip to the PCB motherboard. Packaging substrate is a kind of circuit board used to carry chips. It belongs to a technical branch of PCB and is also the core semiconductor packaging and testing material. It has the characteristics of high density, high precision, high performance, miniaturization and thinness, and can provide support, heat dissipation and protection, and also provide electrical connection and physical support between the chip and the PCB motherboard.
According to the calculation of the consulting agency Prismark, the packaging substrate industry is expected to grow from US$14.2 billion in 2021 to US$21.4 billion in 2026 from 2021 to 2026, with a compound growth rate of 8.6%. Among them, the compound annual growth rate of FC-BGA is 10%, surpassing that of FC. -CSP CAGR of 5%.
The packaging substrate subdivision process corresponds to different products, and can be mainly divided into three levels. Entry-level products include CSP, PBGA, used for chipsets, DRAM, Flash products; general categories include general FCCSP and FCBGA (non-CPU category), which can be used for communication chipsets, SiP modules; high-end categories include complex FCBGA (CPU category ) products, which can be used in CPU, GPU and other products.
Globally, Unimicron, KINSUS INTERCONNECT TECHNOLOGY, and Nanya in Taiwan, China, Ibiden in Japan, and AT&S in Austria all involve high-end products. The following are the top 10 IC packaging substrate manufacturers in the world. Let’s have a look.
Founded in 1912, Ibiden is a Japanese electronics company headquartered in Ogaki, Gifu. It mainly produces electronic related products such as printed circuit boards and IC packaging. The company also produces ceramic products, including particulate filters for diesel engines. Originally as a power generation company, Ibiden has since diversified its business and products. Today, electronic components and ceramics are the company’s main products, and its customers include Apple, Intel and PSA.
2. Kyocera Corporation
Founded on April 1, 1959, Kyocera is a Japanese multinational ceramic and electronic product manufacturer headquartered in Kyoto, Japan. It mainly manufactures technical ceramics, solar power generation systems, telecommunications equipment, office document imaging equipment, electronic components, semiconductor packaging, cutting tools, and components for medical and dental implant systems.
Kyocera has been enhancing and improving SLC technology in response to the demands of the IC packaging market for small and thin substrates. Kyocera offers suitable for flip-chip assembly (peripherals) with a pitch up to 35µm; thin overlay laminates for SiP applications (0.3mmt for 1-2-1); eco-friendly products (halogen-free, lead-free) and a variety of surface finish options (gold plating, lead-free solder coating, OSP, etc.). The production of FC-CSP for digital cameras of mobile phones and smartphones is now possible.
SHINKO was established on September 12, 1946. The company’s main businesses include the manufacture and sale of laminate packages (PLP), lead frames, glass-to-metal seals, heat sinks, ceramic electrostatic chucks, and IC assembly and system module assembly.
SHINKO supplies organic substrates using prepregs for BGA packaging of logic, memory, and sensor devices. 2-layer or 4-layer through-hole substrates are used for devices such as automotive applications that require high reliability, and multilayer structure laminate substrates are also available for semiconductor packages that require miniaturization and high density.
4. Samsung Electro-Mechanics
Founded in 1973, Samsung Electro-Mechanics is a multinational electronics company. It is headquartered in Suwon, Gyeonggi-do, South Korea. It is a subsidiary of Samsung Group. Samsung Electro-Mechanics produces chip components such as MLCCs, semiconductor substrates, camera modules, network modules and printed circuit boards, and is engaged in the semiconductor component business.
In the early days of the company’s establishment, it produced Audio/Video components. In the 1980s, it expanded its business field to materials and computer components. In the 1990s, it devoted itself to developing new products such as chip components, mobile communication components, and optical components. Since the 21st century, Samsung Electro-Mechanics has focused on cultivating businesses such as chip components, camera modules, and communication modules.
Founded in 1987, AT&S mainly designs and manufactures high-end printed circuit boards and substrates for semiconductors, and its products are widely used in the industrial and automotive industries or in the field of microelectronics for mobile devices.
AT&S has its global headquarters in Leoben. There are currently 3 production lines producing a range of different ML/HDI high-end printed circuit boards, embedded solutions for power applications, especially in the server field, and the core of the IC substrate factory. In addition, special technologies for the aerospace and satellite, industrial, automotive and IC markets are developed and manufactured. AT&S holds more than 500 patents for manufacturing high-tech printed circuit boards and IC substrates.
SIMMTECH was established in 1987. It is the first echelon company in the world for semiconductors and mobile PCBs. As a manufacturing enterprise, SIMMTECH has focused on the development and mass production of semiconductor PCBs since its establishment.
SIMMTECH provides cutting-edge PCB products to world-class semiconductor companies based on the world’s strongest manufacturing competitiveness that has been accumulated continuously. Its main product groups are module PCBs for expanding DRAM memory chips and base substrates used for assembling various semiconductor chips.
7. Daeduck Group
Founded in 1965, DAEDUCK is the first company in South Korea to produce printed circuit boards, specializing in the production of semiconductor printed circuit boards, such as CSP, fcCSP, BOC. DADUCK has the best technology for producing ultra-thin packaging substrates including coreless and automation. DAEDUCK can automatically process substrates below 0.04mm core thickness for good quality and has the best delivery cycle system, and has won multiple best delivery system awards from customers.
8. Shennan Circuits
Shennan Circuits was established on July 3, 1984. The company’s business scope includes printed circuit boards, packaging substrate products, module packaging products, etc. Its business covers the world, with subsidiaries in North America and R&D sites in Europe. After years of development, Shennan Circuits has established a long-term and stable strategic cooperative relationship with the world’s leading communication equipment manufacturers and medical equipment manufacturers.
Shennan Circuits focuses on the field of electronic interconnection and continuously strengthens its leading position in the PCB business. Its downstream products focus on communication equipment, focusing on data centers, automotive electronics and other fields, and have long been deeply involved in industrial control, medical and other fields.
Fastprint was established in 1999. The company is headquartered in Shenzhen, China. Dozens of customer service centers of Fastprint have been established at home and abroad, forming a global marketing and technical service network, providing quality services to more than 4,000 customers around the world. Fastprint is committed to “becoming a world-class hardware solution provider”. The products are widely used in communication, network, industrial control, computer application, national defense, aerospace, medical and other industries.
Established in 2002, STG is located in Shenzhen, China. It is a leading professional electronic PCB assembly manufacturer in China. Its main business includes PCB, PCBA, EMS, electronic components, etc.
STG has 18 years of experience in PCB assembly and manufacturing of electronic products, providing turnkey PCB assembly services, including SMT, BGA, COB, and global services for through-hole assembly, IC programming, and functional testing. STG’s products and services are widely used in automotive, electric power, communications, aerospace, medical, industrial control, computer applications and other fields.
What is IC packaging substrate?
Who are the top 10 IC packaging substrate manufacturers in the world?
2. Kyocera Corporation
4. Samsung Electro-Mechanics
7. Daeduck Group
8. Shennan Circuits
How to choose a packaging substrate manufacturer?
When you are looking for a packaging substrate manufacturer, you should take the following factors into consideration so that you can find the best one.
- Company’s reputation
- Delivery time
- Quality and price
- Qualifications and certificates
- After-sale services