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- November 22, 2022
- PCB top list
- (0)
- 05 mins
Top 10 global package substrate suppliers
A package substrate is a rectangular prism of dielectric on which an integrated circuit is mounted. The integrated circuit’s inlet and outlet pins are independently attached to metallic leads on the substrates. These leads link the integrated circuit to the rest of the package.
Package substrate is a material used for mobile devices and PC core semiconductors. It carries electrical impulses amongst chips and the main board while and the main board while also shielding pricey semiconductors from excessive pressure.
Because this substrate is an elevated circuit substrate with more microcircuits than ordinary substrates, assembly faults and expenses associated with directly connecting pricey devices to a substrate can be avoided.
In this article, we are going to learn about the world’s top 10 package substrate suppliers.
Unimicron
Profile: Unimicron Technology Corp (Unimicron) manufactures and sells printed circuit boards (PCBs) and electronic components (ICs). Unimicron products are used in the manufacture of cellular phones, tablet PCs, gaming books, optical transmitters, and CMOS image sensors.
Headquarters Location: Shanying Road, Guishan District, Taoyuan, 333, Taiwan
Established Time: 1990
Revenue: $3.7B
Website: https://www.unimicron.com/en/
Main Products:
- Rigid PCB
- Multi-layer FPC,
- Memory module,
- PCBeam,
- Glass Film
Recent News: In the first half of 2022, Unimicron’s gross profit reached 810 million US dollars, a substantial increase of about 178.3% year-on-year, becoming the company with the highest gross profit of PCB products in the world.
Nan Ya PCB
Profile: Nan Ya PCB Inc. was formed in 1997 as a unit of Nan Ya Plastic Company, which is part of the Formosa Plastic Company. It manufactures PCBs and IC Substrates.
Headquarters Location: Taipei, Taiwan
Established Time: 1997
Revenue: $2.10 Billion
Website: https://www.nanyapcb.com.tw/
Main Products:
- artificial intelligence (AI) chips
- 8K television chips
- light-emitting diode (LED) displays
- cloud server chip
- 5G wireless communication modules
Recent News: The new high-end IC substrate project of Nan Ya PCB has completed registration, with a new total investment of 213 million U.S. dollars and a newly registered capital of 71 million U.S. dollars.
Ibiden
Profile: IBIDEN Philippines, Inc. offers multi-layered goods that are technologically advanced. The company manufactures semiconductors packs for computers, communication devices, and other application-specific devices, as well as plastic, printed circuit boards, and associated items. IBIDEN Philippines services consumers all around the world.
Headquarters Location: Ogaki, Gifu, Japan
Established Time: November 25th, 1912
Revenue: $3.25 billion
Website: https://www.ibiden.com/
Main Products:
- Graphite Specialty,
- SiC-DPF,
- Substrate Holding Mat,
- High-Temperature Insulation Wool,
- IC Package,
- Printed Wiring Board
Recent News: With the growth of IoT, AI, and automotive gadgets, as well as the rising need for elevated and rising infrastructure such as data centers, the semiconductor industry is likely to increase further. The intention is to create a strong position in the IC package substrates market, which will result in the steady expansion of our Electronics company, allowing to meet the medium-term management strategy while keeping up with new needs.
Kyocera
Profile: Kyocera aspires to make the world a better place by harnessing the energy of technology to address global concerns.
This goal is anchored in Kyocera Leadership Rationalization: to help society and humanity progress.
Headquarters Location: Kyoto, Japan.
Established Time: 1959
Revenue: $14.177 billion
Website: https://global.kyocera.com/
Main Products:
- FPC connectors
- Board-to-board connectors
- Backplane connectors
- Wire-to-wire connector
- Shield locks
- Power terminals
Recent News: The company has unveiled a novel technique for producing functional 100 micro meter-long micro-light sources with greater yield and lower cost, allowing short hollow lasers and micro-LEDs for autonomous driving augmented reality and virtual reality applications.
SIMMTECH
Profile: Simmtech Co., Ltd. is a company that makes PCB components. Storage Module PCBs from the company are used to extend semiconductor memory, while Mobile Phone PCBs are utilized in communication equipment like smartphones and GPS devices.
Headquarters Location: Korea
Established Time: 1987
Revenue:$1.14 billion
Website: http://eng.simmtech.com/
Main Products:
- SSD Module PCB
- Memory Module PCB
- Multi-layer Module PCB
- Automotive Board
Recent News: Simmtech Holdings’ first facility in Malaysia, the 385,000 square feet of space plant located on an 18-acre plot in Batu Kawan Industrial Estate in Penang, is presently ramping up production volume to serve the industrial park’s multinational businesses clients.
AT&S
Profile: AT&S is a European printed circuit board company dealing with high circuit board technologies.
Headquarters Location: Leoben, Austria
Established Time: 1987
Revenue: €1.6 B
Website: https://ats.net/en/
Main Products:
- IC substrate
- Substrate-like printed circuit boards
- Flexible and rigid-flex circuit boards
- Thermal enhanced PCB
- HDI PCB
Recent News: AT&S maintained its growth trajectory in the first half of the fiscal year 2022/23, attaining record revenue and profitability levels as a result of its strategy’s effective implementation.
TTM Technologies
Profile: TTM is an abbreviation for “time-to-market.” Consumers may reduce the time it takes to deliver game-changing electronics to the marketplace by using TTM’s time-critical, one-stop sophisticated technologies in the manufacturing services.
Headquarter Location(Global ): California, United States
Established Time: 1978
Revenue: $2.36 billion
Website: https://www.ttm.com/en
Main Products:
- Conventional PCB
- Substrate-like PCB
- Flex/rigid-flex PCB
- Thermal management
- HDI PCB
Recent News: Through RFMW, TTM will provide its whole array of RF&S products, including its tried-and-true Xinger® brand product lineup. The distribution services will comprise distribution, technical sales assistance, and opportunity identification and development. The RFMW online marketplace will furthermore sell the TTM components.
Shenzhen Fastprint Circuit Tech
Profile: Printing circuit boards is the business of Shenzhen Fastprint Circuit Tech. The business makes multilayer printed circuit boards, double-sided printed circuit boards, and other goods. The company offers its goods in a variety of industries, including shipbuilding, aerospace, aviation, and electrical technology.
Headquarter Location: China
Established Time: 1999
Revenue: $783million
Website: https://en.chinafastprint.com/
Main Products:
- Chip size package (CSP)
- Flip-chip CSP
- System in package (SIP)
- Flexible Modified Cementitious
Shennan Circuit
Profile: A division of the Aviation Industry of China is the semiconductor business Shennan Circuits Company Limited (SCC). It is a printed circuit boards designer, researcher, and producer (PCBs). Circuit board assembling (PCBA), systems in package (SIP), printed circuit board (PCB), package substrate, and packaging base plates are among the company’s key products.
Headquarter Location: China
Established Time: 1984
Revenue: $2.2 billion
Website: https://www.scc.com.cn/
Main Products:
- System in package
- Printed circuit board
- Printed circuit board assembly
- Package substrate
- Packaging base plates
LG Innotek
Profile: A division of LG Display Co., LG Innotek Co. Ltd. (LG Innotek) develops, produces, and markets electronic products. Electrical parts, video cameras, 3d imaging components, antenna modules, photomasks, tape substrates, semiconductors, LEDs, and gadgets are among the company’s product offerings.
Headquarter Location: Seoul, Korea
Established Time: 1976
Revenue: $12.49 billion
Website: https://www.lginnotek.com/main/main.do
Main Products:
- Package substrate
- FC-BGA
- Tape substrate.
Recent News: The Science Based Targets Initiative (SBTi) is an international effort to create and confirm the greenhouse gas reduction target in accordance with the criteria established by the Paris Climate Agreement. The goal of LG Innotek’s action plan is to become a net zero corporation by 2030. In July, the company joined the Global Initiative RE100.
