Top 10 global OSAT revenue ranking
According to CINNO Research, in the future, with the continuous increase of application scenarios such as 5G communication technology, Internet of Things, big data, artificial intelligence, visual recognition, and autonomous driving, the industry will require chips with thinner volume, faster data transmission rate, and lower power consumption. Demand will continue to increase.
As an important means to continue Moore’s Law, advanced packaging has become a major increase in the global packaging and testing market in the future, and the market size will continue to grow.
According to CINNO Research, the revenue conditions of the world’s top 10 outsourced semiconductor assembly and testing (OSAT) in the first half of 2022 are as follows:
ASE Technology Holding is the leading provider of semiconductor manufacturing services in assembly and testing.
ASE develops and offers complete turnkey solutions covering front-end engineering test, wafer probing, IC packaging and modules, materials, final test, system, and board level integration and, electronic design and manufacturing services(EMS).
Materials: substrate design, fabrication
Test: front-end test, wafer needle test, finished product test
Packaging: packaging and module design, IC packaging, multi-chip packaging, micro and hybrid modules, memory packaging
Module and motherboard design, product and system design, system integration, logistics management
|Headquarters||Tempe, Arizona, U.S.|
Amkor Technology, Inc. is a semiconductor product packaging and test services provider. The company has been headquartered in Tempe, Arizona, since 2005, when it was moved from West Chester, Pennsylvania. The company was founded in 1968 and, as of 2017, had approximately 29,300 employees worldwide and a reported $4.19 billion in sales.
With factories in China, Japan, Korea, Malaysia, Philippines, Portugal and Taiwan, Amkor is a leading player in the semiconductor industry. It packages and tests integrated circuits (ICs) for chip manufacturers.
JCET is the world’s leading provider of semiconductor microsystem integration and packaging and testing services. Through highly integrated wafer-level WLP, 2.5D / 3D, system-in-Package (SiP) packaging technology and high-performance Flip Chip and lead interconnect packaging technology, JCET’s products and technologies cover mainstream integrated circuit system applications, including Network communication, mobile terminal, high-performance computing, vehicle electronics, big data storage, artificial intelligence and Internet of Things, industrial intelligent manufacturing and other fields.
It has two R&D centers in China and South Korea, six integrated circuit production bases in China, South Korea and Singapore, and marketing offices all over the world. It can carry out close technical cooperation with global customers and provide efficient industrial chain support.
Powertech Technology Inc. is a Taiwanese semiconductor assembly, packaging and testing company.
Powertech Technology Inc. (PTI), the world’s leading OSAT, was founded in 1997. Powertech serves international customers with services including chip bumping, chip probing, IC assembly, final testing, burn-in, and system-level assembly. In 2017 PTI expanded the production base to Japan to serve the local automotive electronics and IoT market. And in 2018, PTI began the construction of the newest Fan Out Panel Level Package manufacturing facility in Hsinchu Science Park.
TFME is a corporation specializing in IC assembling and testing, and is China’s top three IC Package and Test Enterprise. In 2016, TFME ranked 8th globally. The headquarter is located in Chongchuan Zone, Nantong, Jiangsu Province.
TFME have 6 production base: Headquarter, Nantong Tongfu, Hefei Tongfu, TF-AMD Suz, TF-AMD Penang, Xiamen Tongfu. Through development and acquisition, TFME has become the local semiconductor multinational corporation and the leader of China IC Package and Test Industry. At present, there are more than 10,000 employees.
At present, TFME owns several packaging technique such as: Advanced Package& Test technology such as Bumping、WLCSP、FC、BGA、SiP etc.，Traditional Package& Test technology such as QFN、QFP、SO etc.，Automotive Electronics Products and MEMS etc.; Testing technique such as: Wafer Test and System Test.
HT-tech was founded on December 25,2003 and IPO on shenzhen stock exchange on November 20,2007(stock code:002185). Mainly business: semiconductor IC, semiconductor components assembly andtest. HT-tech provides turnkey service for customers, has advanced technical capabilities, system-level production and quality control.
United Test and Assembly Center Ltd is one of the largest providers of test and assembly services for a wide range of semiconductor devices, including memory, mixed-signal/RF and logic integrated circuits. Founded in 1997 by Inderjit Singh and commencing full operations in 1999, the company started out by acquiring the semiconductor test operations of Fujitsu Microelectronics Asia Pte. Ltd.
At the end of 2006, the company was ranked the fifth largest independent provider of semiconductor tests by Gartner Dataquest. Headquartered in Singapore, UTAC has manufacturing facilities in Singapore, Shanghai, China and Taiwan with global sales offices located worldwide including the United States, Italy and Japan.
King Yuan Electronics Corp. (KYEC) provides wafer probing, final product test and assembly service for the semiconductor backend supply chain. KYEC is the second-largest firm in terms of testing revenue and the largest professional pure-play testing company worldwide.
KYEC provides packaging and testing services for the back-end process of semiconductor production globally. The provided services include wafer probing, final product test, burn-in test, assembly services and other services. The production line covers Memory, Logic and Mixed-Signal, System on Chip (SOC), CMOS Image sensor (CIS) / Charge-Coupled Device (CCD), Liquid Crystal Display Driver (LCDD), Radio Frequency (RF) / Wireless and Micro Electro Mechanical system (MEMS) test solutions.
KYEC has over 4000 test platforms in total. KYEC provides packaging services for Ball Grid Array (BGA), Quad Flat No-Lead (QFN)/Dual Flat No-Lead (DFN), Thin Small Outline Packages (TSOP), Land grid array (LGA), Embedded Multimedia Card (eMMC) / embedded Multi Chip Package (eMCP), Memory Card/ MICRO SD Card.
ChipMOS TECHNOLOGIES INC. (“ChipMOS”) is one of the world’s largest semiconductor services companies, providing a full range of back-end testing services for liquid crystal display (LCD) drivers, high density memory, and mixed-signal semiconductors.
In addition, ChipMOS offers a comprehensive selection of leadframe-based and organic substrate-based package assembly services for memory, mixed-signal, and LCD driver semiconductors, which are used in diverse end markets, including consumer electronics, personal computers, communications equipment, office automation and new markets including drones, Virtual Reality and Assisted Reality.
Chipbond was established in 1997 July 2nd and was booked on the Taiwan Stock Exchange starting from 2002 January 31st. Chipbond Technology Corporation is the only company in Taiwan to supply a true full Turnkey Service for backend assembly processing of LCD driver ICs from wafer bumping to packaging. There are two fabs in operation, the LiHsin Plant and the Prosperity Plant are both located within the Hsinchu Science Park. Wafer bumping is conducted in LiHsin Plant whilst the subsequent backend processing such as testing, dicing and packaging is conducted in the Prosperity Plant.