The competition for Mini LED substrates has reached a new climax

The competition for Mini LED substrates has reached a new climax

Table of Contents

MiniLED, also known as sub-millimeter light-emitting diode, refers to an LED with a grain size of about 50-200 μm, and its grain size and dot pitch are between those of traditional small-pitch LEDs and MicroLEDs.


MiniLED is a composite design of embedded metal grid touch elements, including MiniLED flexible substrate layer, MiniLED electrode layer, and chip layer, which are arranged on a heat shrinkable film substrate. The conductive materials include metal grids, nano-silver, etc. The film can be coated on the spherical support after heating, and finally matched with a flexible printed circuit board, so that it can achieve the function of multi-point spherical touch.

The glass-based Mini/Micro LED substrate is the core material of the Mini LED display module. The products are mainly used in notebook computers, tablet computers, automotive, TV, monitors, industrial display and other application fields.

Mini LED glass substrate is mainly used in Mini LED direct display and Mini LED backlight product market, and is the core material of Mini LED products. Recently, BOE has launched P0.9 glass-based Mini LED direct display, 75-inch and 86-inch 8K Mini LED, 34-inch glass-based Mini LED gaming display and other diversified high-end technology products in the MLED field. And it is the first to achieve mass production and commercial use of glass-based Mini LED products.

Glass substrates have outstanding advantages over PCB substrates

Mini LED glass substrates

Compared with PCB substrates, glass substrates have many advantages:

  1. The thermal conductivity of the PCB material is not as good as that of the glass, and when the number of LED chips increases, the service life of the LED will be reduced.
  2. The glass substrate has the characteristics of good flatness and low expansion and contraction coefficient, which can better support the COB packaging of Mini LED chips. When the thickness of the PCB board is less than 0.4mm, when the LED chip is packaged on the PCB substrate, due to the packaging glue Different from the thermal expansion coefficient of PCB material, there may be a problem of glue cracking.
  3. When the backlight is high-definition partition, the glass base can achieve narrow borders and low OD value (the distance between the lower surface of the diffuser and the upper surface of the circuit board), making the TV more thin and fashionable.
  4. The glass base can reduce the area of the backplane according to It needs to be bigger to achieve infinite splicing, but the PCB version is difficult to achieve.
  5. In addition, the cost of the glass substrate is relatively lower compared to the PCB substrate.

The curtain of upgrading from PCB to glass substrate has been opened

As the mainstream backplane of the LED display industry, PCB has already stabilized its market position in the industry. According to relevant analysis, the three major industries of PCB downstream demand will usher in the peak period of development this year, including new energy vehicles, Mini LED and virtual reality XR equipment, which are new growth points of the PCB industry.

Mini LED is an irreversible development trend in the LED display industry. On this basis, the demand for PCB boards will only increase in recent years. At present, the glass substrate that can compete with PCB boards has shifted from liquid crystal display to Mini LED, and silently digs its own place in the territory of PCB boards.

Mini LED display

Glass substrates are mainly used in liquid crystal displays. However, with the update and iteration of display technology, the boundary line between PCB boards and glass substrates is gradually blurred. Especially in the field of new display technologies such as Mini/Micro LED, Mini LED backlight technology has broken the two boundaries between applications. With the maturity of ultra-fine pitch LED display products, the core direction of the future industry has become a foregone conclusion.

However, while admiring the technological progress of spacing index and massive transfer, the breakthrough in another key direction has not received due attention, that is, the carrier of LED display should also be with finer pitch and denser. , a more refined standard to upgrade.

Therefore, finding a new driver backplane for Mini LED has become the key to maintaining optimal product technical characteristics in terms of heat dissipation, stability, ultra-thin integration, and high-density integrated control. At this time, the glass substrate made a grand debut. Because the core material of the glass substrate and the LED crystal are both inorganic semiconductor crystals, the two are closer in thermal effect deformation coefficient, and the ultra-thin strength and heat dissipation capacity of the glass itself are also stronger.

At the same time, practice has proved that glass substrates are also more friendly to mass transfer technology. Therefore, the realization of glass substrate applications on Mini LED and Micro LED has become a new direction.

Glass-based Mini LED accelerates upgrade

At present, the application of Mini LED glass-based products in the field of backlight is mainly concentrated in TV, display and other fields, and gradually penetrates into other fields such as MNT and automotive products. Due to the performance improvement brought by Mini LED products, under the requirements of high image quality, high contrast, and ultra-thinness, Mini LED glass substrates provide a broad application space for them.

Mini LED backlight technology

On the other hand, the application of Mini LED glass-based products in the field of backlighting mainly focuses on transparent display and cinema display. Because the Mini LED glass base has the characteristics of high transparency (>60%), it can achieve high integration with various scenes, so as to meet the requirements of more diversified and intelligent display products.

At present, Mini LED glass substrates have become the choice of more and more Mini LED products, as shown in the fact that major terminal manufacturers including Apple and Samsung have successively released glass-based Mini LED display products, further demonstrating that glass-based Mini/Micro LED substrates have been Recognized by the industry.



To sum up, the Mini LED market is in the ascendant, and the glass base has better application prospects than the PCB base. With the promotion of upstream companies and terminal giants, it is worth continuing to pay attention to whether the Mini LED glass base can replace the PCB base in the future.

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