In the ever-evolving world of electronics, printed circuit boards (PCBs) play a crucial role. PCB assembly techniques have advanced significantly, offering various options for manufacturers. One such technique is through-hole technology (THT), which has been used for decades and is…

Wondering what is SMT assembly, or how it works? The process of surface mount technology (SMT) assembly is essential for creating reliable and durable products and it is considered one of the most important parts of today's modern electronics manufacturing…

In the manufacturing industry, Arduino Nano boards are widely used. It is known for its compact size and feature-rich design, making it an attractive choice for those looking to integrate it into their production processes. In this guide, we will…

PCB chemicals are essential raw materials in PCB production. Many vital processes, such as electroless copper deposition, electroplating, and copper surface treatment in the PCB manufacturing process, require many PCB chemicals. Therefore, we must deeply understand PCB chemicals, including their…

As technology advances, the demand for high-performance computers continues to rise. One of the most critical components in a computer system is the CPU (Central Processing Unit), which acts as the computer's brain and performs all the necessary calculations to…

The Arduino Leonardo is a microcontroller board. It belongs to the Arduino family of boards. Therefore, it has similar functionalities to the Arduino Uno. Nonetheless, it still has several differences from the Arduino Uno. For instance, the Arduino Leonardo has…

The characteristics of SMT process technology can be reflected by the difference between it and traditional through-hole technology (THT). From the perspective of assembly process technology, the fundamental difference between SMT and THT is "sticking" and "inserting". The difference between…

BGA assembly is the procedure used to assemble a ball grid array onto a printed circuit board. A BGA package is a surface-mounted IC. Rather than the conventional pins, a BGA package uses small solder balls at its bottom. Many…

Electronic assembly technology is constantly advancing along with the development of electronic SMT component packaging technology. What kind of device packaging is there, what kind of assembly technology will be produced. That is, the packaging form of electronic components determines…

With the development of electronic technology, the pitch of device pins on the circuit board is getting smaller and smaller, the arrangement of devices is denser, and the electric field gradient is larger, which makes the circuit board more sensitive…