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- December 4, 2022
- PCB knowledge
- (0)
- 07 mins
Which one is better surface mount VS through hole
If you’re interested in learning about the manufacturing process of surface mount vs through hole, you’ve come to the right place. Both methods have their own set of pros and cons, and it’s important to understand the difference between them before choosing a manufacturing process for your project.
The definition of surface mount vs through hole
Surface mount technology (SMT) is a way of soldering components to the surface of boards, rather than through holes in the board. This method is faster and less expensive than through-hole soldering technology, and it often results in a lighter and smaller final product. However, SMT is rather difficult to repair and is not always compatible with all types of components.
Through-hole technology simply means that the components to be mounted on a PCB have pins or tabs that fit through holes drilled in the PCB, and plated with conductive material. The component can then be mounted and soldered to the PCB. This method is more expensive and time-consuming than SMT, but it’s more reliable and easier to repair.
Through hole technology is also compatible with a wider range of components. So, which manufacturing process, surface mount or through hole is right for your project? It depends on your specific needs and requirements. If you’re looking for a fast and cost-effective solution, surface mount technology is a good option. But if you need a more reliable and durable product, through hole will be the best.
The difference between surface mount vs through hole
There are also differences in size, cost and lead time if we compare surface mount vs through hole.
- Cost: Surface mount (SMT) is cheaper than traditional through hole (THT). However, the difference varies depending on the manufacturer you choose.
- Lead times: SMT boards generally have shorter lead times than their THT counterparts because there are fewer layers to manufacture them; therefore it takes less time to get your orders ready for production.
- Surface mount is cheaper, but through hole is more reliable.
The advantages of surface mount vs through hole
Several advantages of surface mount vs through hole are given below:
- Less time spent on design and assembly: While using SMT process, you can take advantage of the latest technologies which results in less time spent on design, assembly and testing of your product.
- Surface mount components are smaller, lighter, and also cheaper to produce. They are easier to install in a circuit due to their smaller size.
- With SMD, you do not need to drill holes in your board to accommodate leads, so you can also reduce costs due to fewer steps in production.
On the other hand, Through-hole components are typically larger than SMT components, so they take up more real estate on the circuit board. Because of their size and shape, through-hole components can be difficult to solder directly onto a circuit board without damaging them or causing shorts between pads (which can damage your device).
The disadvantages of surface mount vs through hole
Some of the main disadvantages of surface mount vs through hole are the following:
Surface mount components have a thinner lead pitch (the distance between the top and bottom of each component). This means that there’s less space between them for heat to dissipate during soldering. Surface mount is less reliable than through-hole.
One of the biggest disadvantages of through-hole components is their size. A through-hole component has two leads, one for power and one for ground. When you insert a lead into an assembly, it’s easy to accidentally damage another lead when you insert tools or other parts near it. This can cause issues with your circuit board or even make your device unusable entirely by removing valuable space from your circuit board design.
In addition to being difficult to work with, through-hole components are also more expensive than surface mount alternatives because they have larger footprints on both sides of their PCBs .
The manufacturing process of surface mount vs through hole
There are two main types of printed circuit boards based on manufacturing process: surface mount vs through hole. The manufacturing process for each is quite different.
Surface mount boards are made by mounting electronic components on the surface of the board. This is done using solder paste, which is a mixture of solder and flux. The board is then placed in a reflow oven, which heats the board to a temperature that melts the solder paste and creates the connections between the components and the board.
Through hole boards are made by drilling holes in the board and then inserting the electronic components into the holes. The connections are then made by soldering the leads of the components to the pads on the board.
Both types of boards have their advantages and disadvantages. Surface mount boards are more compact and often have a higher circuit density, but they can be more difficult to work with. Through hole boards are easier to work with but are often less compact. Surface mount boards are generally used for high-density applications, while through hole boards are used for applications where ease of assembly is more important.
What should be considered when choose between surface mount vs through hole
When it comes to choosing surface mount vs through hole, there are a few things to consider. The first is the size of your project. If you’re working on something small, surface mount might be the way to go. Through hole is better for larger projects.
The second thing to consider is the complexity of your project. Surface mount is more suited for simple designs, while through hole is better for complex designs.
The third thing to consider is the cost. Surface mount is usually less expensive than through hole.
Finally, you’ll need to decide which method is best for your project. If you’re not sure, it’s always a good idea to consult with a professional.
Surface mount technology (SMT) is a way of soldering components to the surface of boards, rather than through holes in the board. This method is faster and less expensive than through-hole technology, and it often results in a lighter and smaller final product. However, SMT is rather difficult to repair and is not always compatible with all types of components.
Through-hole technology simply means that the components to be mounted on a PCB have pins or tabs that fit through holes drilled in the PCB, and plated with conductive material. The component can then be mounted and soldered to the PCB. This method is more expensive and time-consuming than SMT, but it’s more reliable and easier to repair.
There are also differences in size, cost and lead time if we compare surface mount vs through hole.
●Cost: Surface mount (SMT) is cheaper than traditional through hole (THT). However, the difference varies depending on the manufacturer you choose.
●Lead times: SMT boards generally have shorter lead times than their THT counterparts because there are fewer layers to manufacture them; therefore it takes less time to get your orders ready for production.
●Surface mount is cheaper, but through hole is more reliable.
Several advantages of surface mount vs through hole are given below:
●Less time spent on design and assembly: While using SMT, you can take advantage of the latest technologies which results in less time spent on design, assembly and testing of your product.
●Surface mount components are smaller, lighter, and also cheaper to produce. They are easier to install in a circuit due to their smaller size.
●With SMD, you do not need to drill holes in your board to accommodate leads, so you can also reduce costs due to fewer steps in production.
Conclusion
As we have discussed in detail surface mount vs through hole, SMT and THT are two methods for producing electronic circuits. SMT stands for surface mount technology, which means the components are attached to the board by either soldering or reflow soldering.
Through-hole is a technology in which the leads are inserted into holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side either by manual assembly (hand placement) or by the use of automated insertion mount machines.
There are many differences between these two different methods when it comes to production processes and cost considerations, but one thing that can’t be argued is that both have their strengths and weaknesses.
We hope this article helped you better understand surface mount vs through hole.
