-
- November 25, 2022
- PCB knowledge
- (0)
- 07 mins
How IC packaging protects the circuit technology and improves electrical connectivity
What is IC packaging and why it is important?
IC packaging is a process of assembly of the die and substrate. The package serves as a protective enclosure that protects the die from environmental damage, while also allowing for better electrical connections between the components within it.
The technology behind IC packages has evolved, with today’s materials and techniques being significantly different than those used in the 1970s when ICs were first introduced into commercial use.
IC packaging is critical to the success of an IC. It’s a packaging material that can protect and insulate your device from environmental factors such as heat, cold, humidity and vibration. To ensure your product has the best chance for success in its intended market, you must choose the right type of IC packaging for your application.
The benefits of IC packaging
The benefits of IC packaging include:
★ Protection from damage and corrosion.
★ Dissipation of heat by dissipating it through the package; helps prevent the package from becoming too hot and damaging your chip.
★ Interconnection between components that use different voltages or currents can be achieved using IC packaging, which provides flexibility in terms of layout design for PCBs used in industrial applications where cost reduction is required due to manufacturing costs being high compared with other parts; also allows for easier wiring because there are fewer connections needed overall compared with wires going directly into circuits without using an IC package first (e.g., using surface mount technology).
Types of IC packaging
IC packaging is a vital part of the whole process. There are many types of IC packaging, but they all serve different purposes. The most common packaging types are:
★ Chip carrier – This is where the chip or die is mounted onto a carrier and then placed in an assembly. It can be done using tape or epoxy bonding with pins to connect them.
★ Through-hole packages – These packages have holes punched through them by using through hole soldering so that you can easily insert your chips into your circuit boards without having any issues at all! They’re extremely popular because they’re easy to use and have fast manufacturing processes making them ideal for mass-production applications such as computer chipsets.
★ Surface mount packages – These packages are the most popular type of IC packaging as they’re extremely easy to assemble using automated assembly machines. They’re also cheap compared to other types of packaging, so if you want a lot of ICs then this is the way forward!
★ Leadless packages – These packages don’t have any leads on them, so they’re extremely easy to assemble and install. They’re also incredibly small so you can fit a lot more of these into your circuit boards than other types of IC packaging.
Difference between rigid and tape package substrates
Rigid PCB substrates are made of ceramic, glass or metal. These materials are suitable for devices that need to withstand high temperatures, such as ovens and furnaces. Tape substrates are made of plastic. Plastic is cheaper than metal or ceramic, so it’s more affordable for manufacturers to use these types of packaging materials in their products.
Tape substrates are preferred over rigid substrate because they are inexpensive, durable and can withstand wear and tear in low-density devices (LDDs), which includes smartphones, laptops etc., while rigid substrates may not be able to handle such harsh conditions at all times due to its heavy weight or strong material composition.
The type of tape used on the product also contributes to its cost. In general, there are two types of tape: pressure-sensitive and non-pressure-sensitive tapes.
★ Pressure-sensitive tape is more common because it can be applied easily and quickly by hand or machine.
★ Non-pressure sensitive tape is more expensive because it requires a specialized machine to apply it. Pressure-sensitive tape is also better at holding the product together and preventing its components from falling apart.
Materials for IC packaging and the mode of assembly
The materials used to build IC packaging can be broken down into three main categories: Leadframe materials, ceramic packages, and laminate materials.
Leadframe materials are the most commonly used for building ICs. These are used to form the core of the package (the part that holds all of the other components), as well as to provide support for other components such as PCB resistors and capacitors. Leadframe is typically made from tin or a tin-lead alloy (SnPb) or copper. They are usually coated with a thin layer of gold or platinum to improve their conductivity.
Ceramic packages come in many different varieties, but they all share a common feature: they’re made from ceramic material. Ceramics are often used because they are non-corrosive, which means they won’t damage other parts of your device if they mix during assembly or disassembly. Ceramic packages also tend to have lower power requirements than other forms of ICs, so you can use them in places where space isn’t so valuable—like inside your car’s engine compartment!
Laminate materials are similar to ceramic packages in that they’re made from ceramic materials, but they’re more flexible and easier to work with. They’re also cheaper than ceramic packages and can be made in more shapes and sizes. The disadvantage of laminate packages is that they don’t have as good thermal conductivity as ceramic packages do.
Encapsulants for IC packaging
Encapsulants are a type of coating that protects the IC packaging from damage during handling, processing and assembly. The most common types of Encapsulants include Kapton, polyimide (PI) and epoxy. Kapton is a synthetic polymer with excellent thermal stability and low viscosity, which makes it an ideal material for use in high-temperature applications such as ovens or furnaces.
Polyimide (PI) has excellent moisture resistance properties that make it ideal for moisture-sensitive applications such as electronic packaging devices like RFID tags or semiconductors used in medical devices.
Epoxy coatings provide chemical resistance against harsh environments like strong acids and bases because they contain two different types of molecules (e/h) which can neutralize each other upon contact with water molecules present within these liquids/solids packages making them suitable for outdoor environments where contaminants may cause problems due to corrosion caused by oxygen absorption through perspiration or skin contact – which could lead potentially fatal consequences if left untreated!
Design points of IC packaging
When designing an IC packaging, you need to consider a few things:
★ Design and manufacturing of the packaging. The design and manufacturing of IC packaging materials are often done by a third-party supplier who has experience with these processes. They need to understand what your company wants from its product as well as how it will be used by customers for them to provide solutions that will fit your needs and requirements.
★ Designing assembly processes for each type of IC packaging (e.g., plastic or metal). This includes determining what types of machines are needed at different stages during assembly, such as trimming machines or punch pressers; they also need knowledge about how much time each machine can take before running out of material due to high workloads like those seen during holidays when demand increases significantly over normal levels.
IC packaging is a process of assembly of the die and substrate. The package serves as a protective enclosure that protects the die from environmental damage, while also allowing for better electrical connections between the components within it.
1. Protection from damage and corrosion.
2. Dissipation of heat by dissipating it through the package.
3. Helps prevent the package from becoming too hot and damaging your chip.
The materials used to build IC packaging can be broken down into three main categories: Leadframe materials, ceramic packages, and laminate materials.
Conclusion
As you can see, there is a great deal of importance to IC packaging. If you want to ensure your product’s success in the market, it is strongly advised that you use IC packaging.
The benefits include:
★ It protects the device against damage during transportation and storage.
★ It makes it easier to handle by avoiding breakage due to shocks or excessive pressure on the container itself.
★ It ensures stability at high temperatures (up to 100°C).
The IC packaging market has seen growth over the past few years and will continue to do so in the upcoming years as well. With new technologies such as 3D printing, optical lithography etc., there is a lot of potential for innovation in this industry. As mentioned before, these innovations will help with product design and manufacturing processes and make them more cost-effective too.
