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- September 18, 2023
- PCB knowledge
- (0)
- 05 mins
What is Chip on Board Technology – The Basics to Know
CoB technology, also known as Chip on Board technology, has greatly revolutionized the semiconductor industry by offering a cost method of packaging integrated circuits for specific uses. This significant advancement has had an effect, on sectors, particularly high-end consumer electronics that demand compactness and small form factors.
What is the meaning of Chip on Board?
Chip on Board, often abbreviated as COB, is a semiconductor packaging technology where a bare semiconductor chip is directly mounted onto a printed circuit board (PCB) or substrate.
In this procedure, the semiconductor chip gets connected to the PCB using wire bonding or other methods of interconnection. Afterward, it is coated with a resin or epoxy, for protection, against factors. To enhance its durability.
What is the difference between IC and COB?
Both Integrated Circuits (IC) and Chip on Board (COB) involve semiconductor chips, but they differ significantly in their packaging and applications. Integrated Circuits are typically enclosed within a small package with pins or leads for connection, while COB involves mounting the bare chip directly onto a substrate.
Integrated circuits (ICs) are often used in situations where small size and low power consumption are important like, in consumer electronics, mobile devices and microcontrollers. Conversely, Chip On Board (COB) is favoured for applications that prioritize reliability, durability and thermal efficiency. This is particularly true, in electronics, industrial controls and LED lighting.
Features of Chip on Board
a. Compact Design: Chip on Board enables a design that’s both compact and space-efficient since the chips are mounted directly onto the PCB without requiring extra packaging.
b. Enhanced Reliability: The direct connection of the chip to the PCB reduces the chances of wire bonding failure, making COB more reliable, especially in high-stress environments.
c. Improved Thermal Management: The direct connection of COB, to the substrate enables heat dissipation, which makes it ideal, for applications that demand thermal management.
d. Cost-Efficiency: Chip on Board can offer a budget option, for large-scale production as it removes the necessity, for packaging materials.
Applications of Chip on Board
a. LED Lighting: COB LEDs are commonly employed in lighting applications due, to their luminosity, dependable performance and space-efficient design.
b. Automotive Electronics: COB technology is used in automotive control units and sensors due, to its ability to withstand conditions and its durability.
c. Medical Devices: Medical devices frequently depend on COB technology due, to its size and dependable nature.
d. Industrial Controls: COB finds application, in industrial control systems and automation equipment due to its durability and excellent thermal performance.
What are the Advantages of Chip-on-Board Technology?
●The Chip on Board offers a compact design. COB direct mounting of bare semiconductor chips onto a substrate eliminates the need for additional packaging, resulting in space-efficient solutions. This characteristic is particularly valuable in applications where size constraints are paramount.
●COB technology boasts enhanced reliability. COB ensures robust performance, even in challenging and high-stress environments by minimizing the risk of wire bonding failures and other potential points of weakness. This reliability is crucial for applications where downtime is not an option, such as automotive electronics and industrial controls.
●COB possesses thermal management capabilities. Attaching chips to the substrate allows for the dissipation of heat making it particularly suitable, for applications demanding high power like LED lighting and power electronics.
●In large-scale production it can be economically advantageous. By eliminating the need, for packaging materials and optimizing assembly procedures cost savings can be achieved compared to Integrated Circuits (ICs).
What are the Disadvantages of Chip on Board?
●It lacks flexibility. Once the semiconductor chip is attached to the substrate and sealed it becomes difficult to replace or upgrade components. This lack of flexibility can pose challenges, in situations where adaptability is crucial.
●It offers complexity in the manufacturing process. COB technology requires specialized equipment and expertise, making it more challenging to set up and operate compared to traditional Integrated Circuit (IC) packaging methods. This complexity can result in higher initial setup costs and longer lead times for production.
●COB technology can have a higher initial cost due to the specialized equipment and materials required. While it may lead to cost savings in mass production, the initial investment can be a barrier for smaller-scale projects or prototypes.
How Chip on Boards are Made?
A printed circuit board (PCB) or substrate is prepared with the necessary circuitry and pads to accommodate the bare semiconductor chip. The next step is die-attach, where the bare chip is carefully placed onto the substrate and secured using specialized adhesives, ensuring precise alignment. Following this, wire bonding is employed to establish electrical connections between the chip’s bonding pads and those on the substrate.
This step requires high precision and is often automated for accuracy. Once the electrical connections are established, the entire COB assembly undergoes encapsulation, where it is coated with a protective resin or epoxy to provide mechanical stability, environmental protection, and enhanced heat dissipation.
After rigorous testing for functionality and reliability, the COB assemblies are trimmed to remove excess material and then singulated into individual units, preparing them for integration into electronic devices.
Chip on-Board Packaging Process
Once the manufacturing of Chip on Board (COB) assemblies is complete they undergo testing to confirm their performance and reliability. These tests involve examining the connections and functionality to ensure everything is, in order. Additionally thermal assessments are conducted to guarantee heat dissipation.
After the testing phase is successfully finished the COB assemblies undergo trimming to eliminate any surplus material resulting in an consistent appearance. Trimming also aids in optimizing the size and form of the COB assembly.
In the end, the COB assemblies are separated into units. This process includes dividing the assemblies into components preparing them to be integrated into electronic devices, like sensors, control units or LED lighting systems.
Conclusion
Chip on Board(COB) technology represents a significant advancement in semiconductor packaging. Its unique features, such as compact design, enhanced reliability, as well as improved thermal performance, make it well-suited for various applications across different industries.
Though there may be some limitations and intricacies, in its manufacturing process COB remains a favored option for situations where durability and performance’re of importance. As technology advances Chip on Board technology is expected to have a growing impact, on shaping our interconnected and automated world.
Chip on Board, often abbreviated as COB, is a semiconductor packaging technology where a bare semiconductor chip is directly mounted onto a printed circuit board (PCB) or substrate.
Both Integrated Circuits (IC) and Chip on Board (COB) involve semiconductor chips, but they differ significantly in their packaging and applications. Integrated Circuits are typically enclosed within a small package with pins or leads for connection, while COB involves mounting the bare chip directly onto a substrate.
- Compact Design
- Enhanced Reliability
- Improved Thermal Management
- Cost-Efficiency
