CCL and FCCL

CCL and FCCL

CCL stands for Copper Clad Laminate, while FCCL stands for Flexible Copper Clad Laminate.

CCL is a type of material used in the fabrication of printed circuit boards (PCBs). It typically consists of a layer of copper foil bonded to a non-conductive substrate material such as fiberglass (FR4) or composite materials like epoxy resin. The copper foil serves as the conductive layer for the circuitry, while the substrate provides mechanical support and insulation between conductive traces.

FCCL, on the other hand, is a specialized type of CCL designed for flexible circuit applications. It is constructed similarly to traditional CCL but with a flexible substrate material such as polyimide instead of rigid materials like fiberglass. FCCL allows for the creation of flexible and bendable circuits, making it suitable for applications where space constraints or dynamic movement are considerations, such as in wearable electronics, medical devices, and flexible displays.

Both CCL and FCCL play critical roles in the manufacturing of electronic devices, providing the foundation for creating intricate circuitry and enabling the functionality of various electronic components.

Copper Clad Laminate (CCL)

Copper Clad Laminate (CCL)

Copper Clad Laminate, abbreviated as CCL, is a type of PCB substrate. CCL serves as the core material for PCBs, excluding coreless rigid boards. In PCBs that contain substrates, there is at least one substrate in the stack-up, and the substrate forms the foundation for increasing the number of layers in the PCB.

1. Basic Information about CCL

– Copper Clad Laminate (CCL), also commonly referred to as the core.

– The substrate is composed of copper foil and PP (Polypropylene) pressed together.

– The substrate serves as the core material for PCB rigid boards.

– With the increasing demand for PCBs that are lightweight, thin, short, and small, the popularity of coreless products is also growing.

2. Shipping Forms of CCL

Sheet Shipping:

PCB manufacturers commonly receive CCL in sheet form, with standard sizes such as 43×49 inches, 41×49 inches, and 37×49 inches. Before use, PCB manufacturers will cut the sheets into different panels according to their requirements.

Panel Shipping:

PCB manufacturers directly purchase the required CCL in panel form. Common panel sizes include 21×24 inches, 21.25×24.25 inches, 20×24 inches, 20.25×24.25 inches, 18×24 inches, 18.25×24.25 inches, and so on.

3. Common Knowledge about CCL in PCB Manufacturing

Substrates can be classified into symmetric and asymmetric substrates based on whether the copper foil on both sides is the same.

Common substrate naming conventions:

– Sheet Substrate (example): 4mil H/Hoz 42×48 inches
– Panel Substrate (example): 4mil H/Hoz 21.25×24.25 inches

Common substrate thicknesses include: 2mil, 2.5mil, 3mil, 4mil, 5mil, 6mil, 8mil, 10mil, 12mil, 14mil, 16mil, 18mil, 21mil, 28mil, and 31mil.

Generally, substrates below 31mil/0.8mm do not include the copper foil thickness. Specific information should be referenced from the material supplier’s specifications or confirmed with the material supplier.

In general, single-sided copper foil substrates for PCB rigid boards are relatively uncommon.

Flexible Copper Clad Laminate (FCCL)

Flexible Copper Clad Laminate (FCCL)

Flexible Copper Clad Laminate, abbreviated as FCCL, is an essential raw material for flexible PCBs (FPC).

– Flexible Copper Clad Laminate (FCCL), also known as flexible copper foil, flexible copper board, or flexible copper laminate.

– FCCL serves as the processing substrate for flexible printed circuit boards (FPC).

– While CCL is used for rigid boards, FCCL is used for flexible boards.

FCCL is divided into two main categories:

1. Traditional adhesive-type three-layer flexible board material (3L FCCL): A flexible copper foil composed of three different materials: copper foil, film, and adhesive, is called a three-layer flexible copper laminate (referred to as “3L-FCCL”).

2. New adhesive-less two-layer flexible board material (2L FCCL): A flexible copper foil composed of a flexible insulation base film and metal foil without adhesive is called a two-layer flexible copper laminate (referred to as “2L-FCCL”).

These two types of FCCL have different manufacturing methods, resulting in different material characteristics. Accordingly, they are applied to different product projects.

3L-FCCL is used in mass-produced flexible board products, while 2L-FCCL is applied in higher-end flexible board manufacturing, such as flexible-rigid boards and Chip-on-Flex (COF). This is because 2L FCCL is more expensive and its production capacity is insufficient to meet the demand for higher-end flexible boards.

FCCL vs CCL

CCL consists of PP and copper foil, while FCCL consists of PI and copper foil, possibly including AD adhesive, making its composition relatively complex.

Generally, the selection of FCCL needs to consider several dimensions as shown in the table below; the selection of CCL is relatively simple.

CCL and FCCL are both materials used in electronics, particularly in the fabrication of printed circuit boards (PCBs). The primary difference between the two lies in their flexibility.

Copper Clad Laminate (CCL):
CCL is a rigid material used as the substrate for PCBs in many electronic devices.

It typically consists of a non-conductive core material (often fiberglass or epoxy resin) with copper foil bonded to one or both sides.

CCL provides structural support and electrical insulation for the circuitry on the PCB.

Flexible Copper Clad Laminate (FCCL):
FCCL, as the name suggests, is a flexible version of CCL.

It is designed to be bendable or flexible, allowing it to conform to curved or irregular surfaces.

FCCL is commonly used in applications where traditional rigid PCBs are not suitable due to space constraints or where flexibility is required, such as in wearable electronics, flexible displays, or automotive electronics.

In summary, while both CCL and FCCL serve as the base material for PCBs, FCCL offers the added benefit of flexibility, making it suitable for applications where rigidity is not desirable or feasible.

Sign up for newsletter

Get latest news and update

Newsletter BG