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- February 21, 2023
- PCB knowledge
- (0)
- 05 mins
BGA assembly – a basic guide for new beginners
BGA assembly is the procedure used to assemble a ball grid array onto a printed circuit board. A BGA package is a surface-mounted IC. Rather than the conventional pins, a BGA package uses small solder balls at its bottom.
Many of household electronic devices, such as computers and smartphones, depend on a BGA assembly. They are an ideal pick for applications that depend on limited available space.
What is BGA Assembly?
BGA assembly is the process of putting together a type of integrated circuit known as a ball grid array onto a printed circuit board. The process follows a procedure of applying solder paste to a printed circuit board. Thereafter, the BGA package is placed onto the paste. Lastly, reflowing the solder is in a specialized oven. After this process is complete, there’s a potent and reliable electrical connection between the PCB and BGA package.
How Does BGA Work?
The integrated circuit is mounted onto a tiny substrate that’s made of fiberglass or ceramic with small metal pads below. The metal pads are present in a grid pattern. They are connected to the IC via wire bonding. They can also be connected using flip-chip technology. Everything is then covered using a protective material to prevent damages.
The major advantage of using BGA packages is that there are more connections between the PCB and IC even when space is limited. Therefore, it can be a great option for complicated circuits that need a high density of connections. The only downside of using BGA assembly is the difficulties in replacement and repair, as compared to other packaging methods. It requires special skills and expertise plus a range of sophisticated equipment.
What are BGA Assembly Machines?
BGA assembly machines are used in BGA assembly. Some examples of BGA assembly machines include the following:
- Reflow ovens
- BGA rework stations
- Automated optical inspection systems
- X-ray inspection systems
- Pick and place machines
They place and solder BGA components onto PCBs with precision. They rely on computer-controlled robotic arms, cameras, and a host of different software to ensure accurate placement of BGA components on the PCB.
For the solder joints, BGA machines employ special heating and cooling methods to ensure robustness and reliability. These machines are applied in several industries, including home appliances.
What is the BGA Assembly Process?
The BGA assembly procedure involves mounting and soldering BGA components onto printed circuit boards. The steps followed include the following:
Stencil Printing
A stencil applies solder paste to the PCB.
Pick-and-Place
Automated machines pick up the BGA components and place them on the PCB. To ensure that all of the components are placed accurately, the machine relies on top-tier cameras.
Reflow Soldering
The board gets heated inside a reflow oven, which melts the solder paste. The result is a potent and reliable bond between the BGA components and the board. As the process takes place, the tiny metallic balls below the BGA components melt into solder joints.
Inspection
To ensure that all of the parts are affixed where they should be, inspection is necessary. There shouldn’t be any defects such as open connections, shorts, or defects.
Advantages of BGA Assembly
BGA assembly has a ton of advantages when compared to other electronic component packaging and assembling methods. A number of these advantages include the following:
- Higher density of the components. There’s a higher pin count and a smaller footprint.
- Better electrical performance. Short and direct connections that bring down noise and delays for better performance.
- Enhanced thermal performance. The large thermal pad at the bottom of the package offers good thermal dissipation and performance.
- Lower profile. BGA components have a lower profile than other components. Good for applications with limited spacing.
- Better reliability. Solder joints between the PCB and BGA components cover a large area. This delivers better electrical and mechanical reliability.
- Easier automated assembly. Easier to handle using automatic assembling machines. This cuts down the cost and time taken in assembly.
Applications of BGA Assembly
BGA assembly is applied in several electronic devices, mostly those that need tiny, high-density, and high-performing components. Examples include the following:
- Industrial and manufacturing equipment. Present in industrial automation systems, robots, and many other systems that require precision for safety and efficiency.
- Medical devices. Patient monitors, ultrasound machines, and imaging equipment all rely on the high performance of BGA assembly.
- Defense and aerospace tech. military communication systems, satellite equipment, and avionics all depend good performance and reliability.
- Automotive electronics. Some of the electronics in this space that depend on BGA assembly include safety systems, engine control systems, and infotainment, among many others.
- Consumer electronics. Such include tablets, computers, smartphones, and other consumer electronic devices that need small form factors.
What is BGA Assembly Price?
The cost of a BGA assembly depends on several factors. Some of the most important ones include the following:
- The volume of production.
- Number of components.
- Number of layers in the PCB.
- Size of the BGA package.
- Complexity of the design.
BGA assembly is costlier than some of the other surface-mounted assemblies. Basically, the need to have better precision makes it more expensive. The assembly process has to be perfectly done. Luckily, machines help do this accurately. Also, the solder joints need careful inspection after the assembly process. That is what makes the cost even higher.
Nonetheless, the cost of a BGA assembly can go down based on economies of scale. High-volume orders will make the production run cheaper when compared to low-volume orders. The exact price will depend on the design and specific project at hand. Consult a professional PCBA company to get the details on pricing, volume requirements, and design specifications.
BGA assembly is the process of putting together a type of integrated circuit known as a ball grid array onto a printed circuit board.
The integrated circuit is mounted onto a tiny substrate that’s made of fiberglass or ceramic with small metal pads below. The metal pads are present in a grid pattern. They are connected to the IC via wire bonding. They can also be connected using flip-chip technology. Everything is then covered using a protective material to prevent damages.
- Stencil Printing
- Pick-and-Place
- Reflow Soldering
- Inspection
Final Thoughts
Now that you have gone through all of the details pertaining to a BGA assembly, you’re probably searching for a favorable partner to work with. At IBE, we are here to lend you our full support for the BGA assembly. With extensive knowledge and experience in PCB and PCBA, we guarantee nothing short of quality services. Send us a message or call us to get a quote today. Alternatively, you can ask about our services and capabilities for a greater insight.
